Trainings and Workshops

The great diversification of application scenarios leads to more highly integrated substrates in order to match a wide variety of requirements. Therefore, advanced substrates play a central role in the rapid development of the electronics industry – they make it possible to overcome the limitations of conventional printed circuit boards and create innovative solutions for complex challenges and mission profiles. Their relevance extends across various application areas and technologies that are shaping the future of electronics.

Advanced substrates offer a number of advantages that go far beyond the capabilities of traditional printed circuit boards (PCBs). With the capability to route more contacts and serve a larger number of I/Os due to improved materials and processes, they significantly increase the overall performance of electronic components and pave the way for our next generation products. Novel dielectrics with better RF performance, thinner laminate layers, high aspect ratio vias and the possibility to merge the electronic with the optical domain make it possible to design devices that are not only more powerful, but also smaller and lighter - a decisive advantage in miniaturization and performance.

However, the relevance of advanced substrates does not only extend to technical performance. Their development and application also contribute to better sustainability. Biogenous and biodegradeable materials as well as more resource-efficient manufacturing processes, they can help to reduce the ecological footprint of the electronics industry, enable the circular economy and allow for mass customization to build products specific to a use case.

What to expect from our Experts Sessions

With our online sessions, we want to shed light on various areas of application and technical approaches to this topic.

• 22.10.24: Fan-out Wafer and Panel Level Packaging – A versatile Platform for next Generation 2 and 2.5 D Packaging Solutions
  Dr. Tanja Braun | more info
  
• 05.11.24: Integration of III-V RFICs in Antenna-in-Package modules in PCB-based embedding technology for 5G/6G Applications
  Tekfouy Lim | more info
  
• 19.11.24: High density Organic Substrates
  Lars Böttcher | more info
  
• 3.12.24: Glass Core Substrates
  Ruben Kahle, Julian Schwietering | more info

In our 45-minutes expert sessions we would like to present to you trending topics in a technical presentation. Afterwards, our experts will be available for your questions and comments and a joint discussion.

Fraunhofer IZM stands for application-oriented, industry-focused research. With its technology clusters in the field of wafer and substrate process technology as well as its high competence in simulation and metrology, Fraunhofer IZM covers the entire range required for the realization of reliable electronics and their integration into applications.