Testing, Qualification, Reliability

The in-plane und out-of-plane deformation of materials or composites due to external loads or internal stresses can be investigated by means of digital image correlation.

The internal structure of an apparently homogeneous material can have a considerable influence on its properties. Structural analysis as part of a “physics of failure” approach can identify failure mechanisms so that avoidance measures can be taken.

Reliability Monitoring and Management aims at ensuring the reliability of electronic systems. With wide-ranging expertise about standards and excellent metrological equipment we can analyse vulnerability, determine reliability parameters and provide system level assessments.

A robust design for high vibration exposure requires an understanding of eigen-frequencies, natural modes and damping of electronic systems. Test objects range from minute structures (e.g. 400 µm bond wire) to components measuring up to 200 mm x 200 mm. The measurements and tests can be carried out at defined temperatures and humidity.

Temperature measurements on assemblies with IR thermography and sensors e.g. to measure temperature distribution, hot spot temperatures, and thermal resistance and impedance.

Determining mechanical and thermal parameters for materials for microsystem technology. Allowing for environmental conditions (e.g. humidity and temperature). Also determining parameters for the smallest samples and thin layers.

The demands on robustness and lifetime of electronic components, combined with decreasing development time, require methods that are able to derive the complexity of a system, evaluate it and indicate possible optimization potential in conceivable time.  

Modern electronic systems are increasingly exposed to constantly changing environments in terms of humidity and variations of temperature cycling and thermal shocks. At the same time, the ongoing trend of miniaturization results in smaller designs, components and by that more tightly packaged systems.