Die-to-Wafer Flip Chip Assembly

Process demonstration of 300 mm die stacking
(D2W FC Bonding)

- Die per wafer: 120

- Die size: 20.4 x 20.4 mm

- SnAg-cap on Cu-pillar

- Bump pitch: 55µm

- Bump height: 25µm

- Bump diameter: 25µm

- Bump per die: 143.616

- Bump per wafer: 20.967.936