Glass Interposer Wafer

- 300 mm / 12" glass wafer with thinfilm RDL

- Reticle size 22 x 22 mm²

- Bump pitch: 55 µm, height: 25 µm, diameter: 25 µm

- Interconnects/die: 143.616

- Interconnects/wafer: 20.967.936

- TGV process development realized with cooperation partners