Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
- 300 mm / 12" glass wafer with thinfilm RDL
- Reticle size 22 x 22 mm²
- Bump pitch: 55 µm, height: 25 µm, diameter: 25 µm
- Interconnects/die: 143.616
- Interconnects/wafer: 20.967.936
- TGV process development realized with cooperation partners
Glass Interposer Wafer
Exhibit by IZM-ASSID