R&D services in the field of application-specific high-speed modules, packages & boards
- Investigation of suitable packaging technologies for development of cost-effective and application-specific high-speed modules, packages and boards:
- RF frontend modules for wireless communication interfaces (e.g. for 5G, 6G) of end devices and systems
- High-speed interposers and System-in-Package (SiP) modules in accelerator cards for high-performance computing (HPC), artificial intelligence (AI) and Big Data workloads
- High-speed boards with PCI-Express interface (e.g. PCIe 5.0) for multi gigabit-per-second (Gbit/s) data communication in HPC and AI based systems
- Design and test of RF frontend modules and their building blocks for wireless communication interfaces (e.g. for 5G, 6G) of end devices and systems
- Integrated antenna arrays (e.g. phased arrays, MIMO arrays)
- RF frontend modules
- Packaging platforms (e.g. AiP, SiP) for system-integration of RF frontend ICs and components
- System-level signal and power integrity driven design, measurement and validation of high-speed interposers, boards and modules for HPC, supercomputers and data centers
- Interposers (e.g. silicon, glass, organic) and SiP modules with high-speed, high-bandwidth and low-latency interconnects
- Data communication links/channels in high-speed boards and backplanes with PCI-Express interface (e.g. PCIe 5.0)
- High-speed modules including chiplets, processors, memory and PCIe interfaces for HP
- Design, test and integration of electronic bandgap (EBG) structures in electronic packages and boards for noise reduction and isolation improvement as well as for hardware security applications
Fraunhofer Institute for Reliability and Microintegration IZM