Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM

Services related to Photonic System Assembly

What we provide

  • Optical Design, thermal and electrical Design, Design for Manufacturing
  • Proof and optimization of costumer concepts
  • Component and material selection
  • Prototyping
  • Process implementation ramp-up on high-end bonding equipment
  • Precise optical micro-assembly on substrate or complex module level
  • Automated active alignment of micro-optic and opto-electronic components
  • Technology transfer including equipment specification
  • Consulting for manufacturing and supplier partnering

How we do it

  • Incoming inspection
  • Fiber optical interconnection technologies
  • 2-Photon-Polymerisation (Vanguard) for printed micro-optics and photonic wire bonds
  • Process integration on automated and semi-automated bonding machines (ficonTEC, Nanosystec, PI Physik Instrumente, SmarAct)
  • Adhesive Bonding (UV and thermal)
  • Soldering
  • Sintering
  • Wire bonding
  • Hermetic sealing
  • Reliability testing and failure analysis

Advantages

  • < +/- 0,5µm precision
  • Active and passive alignment
  • In-house reliability testing
  • performance test on component and system level

Applications

  • Packaging of semiconductor light sources: Laser diodes, VCSEL, LED
  • Photonic integrated circuits (PIC) on SOI, SiN, glass
  • Photo diodes
  • Opto-elektronic modules
  • Electro-optical Circuit Boards
  • Glass core photonic substrates with electrical and optical redistribution layer (oRDL)