Equipment Flex Assembly

We offer a variety of assembly and interconnection techniques to our customers, including standard SMD processes as well as various flip-chip process solutions and solutions for applications such as Flex-to-Flex. Fine-pitch flip-chip processes are implemented in a cleanroom environment.

Equipment Flex Assembly:

• SET FC150 Flip-Chip Bonder
• SET FC150 FAV Flip-Chip-Bonder
• Panasonic FCB3 Bonder
• Finetech Sigma Bonder
• Finetech Fineplacer mikro
• Heißsiegel-Bügellötanlage COVATEC SR10-1130/3
• Dispenser Musashi Shotmaster 300
• Datacon evo Flip-Chip-Diebonder
• LPKF ProtoPrint E