Fraunhofer Institute for Reliability and Microintegration IZMQualification and Test Center (QPZ)
Reliability testboard with LTCC-BGA and microvias
In the framework of the Quality and Test Center (QPZ) for electronic assemblies we offer:
- Failure analyses of electronic assemblies
- Failure analysis of LED packages
- Solderability and wettability analysis
- Acceptability of electronic assemblies
- Microstructure analysis of solder joints
- Surface analysis using XPS
- X-ray, C-SAM, CT, FIB, SEM
- Reliability testing and analysis
- Reflow soldering processes
- Void-less soldering
- SIR, Electromigration