Fraunhofer Institute for Reliability and Microintegration IZMFailure analysis SMD
Failure of a CSP-solder joint
Sleeve crack on an LP through-hole plating
SMD failure analyses comprehend analyses in the context of impaired PCB solderability, early failures of plated-through holes and microvias as well as investigations of failed solder joints after field stress. Starting with optical inspection and x-ray microscopy the following methods are applied:
- Metallographic cross sectioning
- Reflected light microscopy for structure evaluation
- SEM/EDX analysis of intermetallic phases
- Focused Ion Beam (FIB) target preparation