Failure analysis SMD
![Failure of a CSP-solder joint](/en/abteilungen/system_integrationinterconnectiontechnologies/leistungsangebot/test_qualifizierungzuverlaessigkeit/schadensanalyse_smd/jcr:content/contentPar/sectioncomponent/sectionParsys/textblockwithpics/imageComponent1/image.img.jpg/1703071406853/160-Fehler-Schadensanalyser-SMD.jpg)
Failure of a CSP-solder joint
![Cracked plated through hole](/en/abteilungen/system_integrationinterconnectiontechnologies/leistungsangebot/test_qualifizierungzuverlaessigkeit/schadensanalyse_smd/jcr:content/contentPar/sectioncomponent/sectionParsys/textblockwithpics/imageComponent2/image.img.jpg/1703071406853/160-Pthcrack-Schadensanalyse-SMD.jpg)
Sleeve crack on an LP through-hole plating
SMD failure analyses comprehend analyses in the context of impaired PCB solderability, early failures of plated-through holes and microvias as well as investigations of failed solder joints after field stress. Starting with optical inspection and x-ray microscopy the following methods are applied:
- Metallographic cross sectioning
- Reflected light microscopy for structure evaluation
- SEM/EDX analysis of intermetallic phases
- Focused Ion Beam (FIB) target preparation