Staff

Professor Martin Schneider-Ramelow, born in Germany’s Emsland region near the Dutch border in 1964, studied materials science at the Technical University of Berlin between 1987 and 1991. He completed his doctorate in materials engineering in 1998.

Between his graduation in 1991 and 1998, he stayed at the TU Berlin as a research associate, spending the first year at the Institute of Metallurgy before moving to the Institute for Materials Science and Engineering.

In August 1998, Martin Schneider-Ramelow joined Fraunhofer IZM in Berlin, initially as a Project and Group Leader (Chip and Wire Technologies). From 2008 to 2018, he was in charge of the System Integration and Interconnection Technologies (SIIT) operations, where his track record included an almost two-fold increase of the department’s budget to more than €12 million, with an expansion of the share of industrial projects from approx. 35% to approx. 45%.

In 2014, he returned as a visiting lecturer to his alma mater, where he was appointed as full professor of “Materials for System Integration” in January 2017. Based at the Institute of High-Frequency and Semiconductor System Technologies in the university’s Electrical Engineering and Computer Science department, his work includes the deputy directorship of the Research Centre for Microperipheral Technologies.

In 2023, Martin Schneider-Ramelow was appointed as the Director of Fraunhofer IZM. In this position, he predominantly concentrates on the strategic direction of the Institute’s activities, including the coaching and professional development of the Institute’s staff and the implementation of the strategy audit’s recommendations.

He is also intensifying his work as a doctorate and postgraduate supervisor and actively developing new mentoring programmes.

Martin Schneider-Ramelow is the prolific author and co-author of more than 250 papers in his field and is considered a specialist for the quality and reliability of metallic interconnects and an internationally recognized expert for wire bonding technology. As such, he contributed substantially in his role as the Chair of the working group 2.4 “Bonding” of the German Welding Society DVS to the new edition of the DVS standard 2811. Replacing its predecessor after 20 years, the new document issued in 2017 has become the standard reference for evaluating high-quality wire bonds.

He is also a member of six national and international conference programme committees in the field of electronic packaging, a Senior Member of the IEEE, and Fellow of IMAPS USA, and in 2020 celebrated his tenth year as the Presiding Chairman of the International Microelectronics and Packaging Society (IMAPS) Germany.