Events MikroSystemTechnik conference

Conference / October 23, 2023 - October 25, 2023

MikroSystemTechnik Congress 2023

The largest German-language congress in the field of electronics and microsystems, the MST Congress, will take place in Dresden from October 23 - 25, 2023. For its tenth anniversary, the event will focus on sustainability and technological sovereignty. Topics such as Technological Sovereignty, Trusted Electronics, sustainability aspects ("Green ICT") as well as Next Generation Computing will be in the spotlight at this year's congress.

Visit the lectures of IZM colleagues on the future-oriented key technologies of microelectronics and microsystems technology! You will also find us at the joint booth of the Research Fab Germany (FMD - Forschungsfabrik Mikroelektronik Deutschland) - an association of excellent research institutions. Benefit from an intensive exchange and learn how important these technologies are for the economic power and our common good and which future opportunities they offer.

The congress is an important platform for networking, especially for medium-sized companies. It will provide a comprehensive overview of the current state of research and development in the field of microsystems technology as well as technological trends both in Germany and internationally. The MST Congress 2023 is expected to provide strong impulses and prove that the achievement of climate targets and economical, efficient use of energy can only be achieved through the use of microsystems and microelectronics.

We are looking forward to your visit at booth 14 on level 5 of the joint booth of Forschungsfabrik Mikroelektronik Deutschland!

Event details

Registration

Location

Maritim Hotel & Internationales Congress Center Dresden
Devrientstr. 10 - 12 / Ostra-Ufer 2
01067 Dresden

Phone: +49 (0) 351 216-0
Fax: +49 (0) 351 216-1000
Reservation: +49 (0) 351 216-1018
info.dre@maritim.de

Date

October 23, 2023 - October 25, 2023

Download this event as iCal

Organization

VDE e. V.

Solutions for Sustainable Digitalization

The »Green ICT @ FMD« Center of Competence

For the high-profile BMBF-funded project „Green ICT“, several Fraunhofer and Leibniz Institutes are joining forces in the Research Fab Microelectronics to establish a cross-institute center of competence for more resource-efficient information and communication technology. Over a period of 3.5 years from the project’s start on 1 August 2022, it will propel the evolution of ICT applications and infrastructures in Germany and Europe towards a more conscious use of resources and substantially use the carbon footprint in the industry. The new center of competence will coordinate different Green ICT themes and issues and equip partners from science and industry with a single source for comprehensive ICT solutions across different technological domains and at a high level of maturity.

more info

The Sensor Packaging Revolution - High-frequency Technology Entirely in Glass

Project GlaRA

Radar sensors for industrial and process metrology, as addressed in the project “Glass Interposer Technology for Implementing Highly Compact Electronic Systems for High-frequency Applications” (GlaRA) sponsored by the BMBF (Bundesministerium für Bildung und Forschung, German Federal Ministry of Education and Research), are a good example of the needs profile described above. Standard packages do not work because of the frequencies exceeding 100 GHz – higher than those of mobile communications technology – and the stricter environmental requirements. They must allow for adaptation to specialized sensor ASICs and permit manufacturing in medium-sized quantities at competitive prices.

To this end, the consortium has developed and characterized a reliable interposer technology as a system-in-package (SiP) based on glass for broadband millimeter wave modules that can be used in sensors and communication at frequencies above 100 GHz. The technology platform demonstrated here constitutes a sensor packaging revolution: Compared to the state of the art, it uses various waveguide concepts, high-density micro wiring, and hermetic encapsulation to increase functions able to be integrated. In addition, it makes applications up to 300 GHz possible thanks to high precision and material qualities. This is implemented within a single material system (glass) through excellent waveguide properties and high-precision micromachining, among others.

more info

Glasinterposer — © Fraunhofer IZM | Volker Mai

SieVei 4.0

Supported by BMBF funding, the SiEvEI 4.0 project was set up to connect production facilities and use the captured data to digitalize business processes. To do so, innovative sensor systems called Secure Smart Items (SSI) were embedded in electronic circuits to monitor the state of systems in industrial environments. SSIs are also used to capture data that can be used to optimize manufacturing processes with ML algorithms. With these SSI, security-relevant systems can be made trustworthy e.g. for use in energy infrastructure or other Industry 4.0 settings. The entire value chain can be hardened against outside attacks with its access records, bringing together the worlds of conventional sensors with AI-assisted, critical, trustworthy electronics systems.

more info

Trusted data acquisition in microelectronics manufacturing as a basis for ML-optimized processing — © Fraunhofer IZM

Omniconnect

The BMBF-funded OMNICONNECT project has developed a miniature radar system that uses four modules to detect emergencies or other needs for assistance in domestic care situations, without infringing the privacy of the occupants. The radar system can track more than 30 people in rooms of up to 150m² with its angular resolution of 12°. It combines AI-assisted radar modules with passive transponders attached to different objects in the room for tracking their location and movement in space with a single radar system. The passive transponders were developed as frequency-specific radar targets that resonate on a specific frequency.

more info

image - Aufbau der Deckenlampe aus Polyurethan mit vier Radarmodulen — © Fraunhofer IZM

IMUCOMPACT

On the IMUCOMPACT project, Fraunhofer IZM has produced a concept for an interferometric fiber-optical miniature gyroscope (IFOG) working on three axes. The project was set up to substantially improve the gyroscope’s performance while keeping the system’s weight down. MEMS gyroscopes can serve as effective photogrammetry sensors in unmanned aerial vehicles because of their extremely small size, light weight, and minimal power needs. They are, however, susceptible to changes in temperatures, humidity, or mechanical stresses. Optical gyroscopes are often preferred as they are immune to electromagnetic effects, can deliver extremely precise rotation rate measurements, and have no moving parts. This has motivated Fraunhofer IZM to produce a reliable, cost-efficient, and compact IFOG relying on Sagnac phase shifts. The three-axis IFOG has been calibrated for changes in ambient temperature, and reliability tests have been conducted e.g. on the system’s thermal stability and response to shocks and vibration.

more info (.pdf/ 2.1 MB)

CAD Modell des 3-achsigen IFOG-System — © Fraunhofer IZM

ZIM OpRes

The ZIM-funded OpRes project has produced a universal optical package using glass to combine photonic and electronic components in a hybrid stack. The optical refraction index sensor is equipped with an LED, PD, and electronic components in a 2.5D glass casing with structured thin-layer metallization. Two demonstrators have been produced: one glass/PCB version (see image) and a full-glass version.

PhotMan

PhotMan is a joint German-Polish initiative, set up to develop a versatile fiber-optical sensor system, based on an innovative sensor technology proposed by the Technical University of Warsaw WUT. The mission of PhotMan is to realize a sensor system for the distributed simultaneous measurement of temperature, UV intensity, and mechanical stresses in the increasingly common fiber-reinforced plastics. The proposed system should record the forces affecting the integrity of the compound both during production and for the long term during its active life. The project is co-funded by the European Regional Development Fund (ERDF).

iCampus Fortune II

For the ForTune II project, a consortium formed by the btu Cottbus, Fraunhofer IZM, and IPMS is producing a multi-sensor subsystem, designed to detect any signs of aging in industrial facilities. The project tries to improve maintenance cycles through predictive maintenance, using artificial intelligence and sensor fusion technology for state monitoring for industrial tools and machines. The wireless multi-sensor system developed in the project is meant for use in different Industry 4.0 scenarios, including the monitoring of large mobile machines and facilities in construction and civil engineering like diggers, cranes, specialized machinery, and internal logistics. The system is also suited to state monitoring applications in the metal processing industry.

Conference presentations MST Congress 2023

Tuesday, October 24, 3 pm - 4 pm – poster sessions

P1.18 B – Materialien, AVT und Simulation

Hardwareimplementierung von intelligenten reflektierenden Oberflächen für die 6. Mobilfunkgeneration
Robert Stöcker, Julia-Marie Köszegi, Michael Kaiser und Ivan Ndip (Fraunhofer IZM, Germany)

P1.24 B – Materialien, AVT und Simulation

Herstellung zuverlässiger elektrischer und optischer Verbindungen für Siliziumnitrid-Photonik mittels Thermokompressionsbonden
Martin Blasl and Meysam Namdari (Fraunhofer IPMS, Germany); Juliane Fröhlich and Hermann Oppermann (Fraunhofer IZM, Germany)

P1.25 B – Materialien, AVT und Simulation

Modular and compact interferometric fiber optic gyroscope configuration for high precision rotary motion
Christian Janeczka (Technische Universität Berlin, Germany); Moritz von Ravenstein (Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration, Germany); Vanessa Zamora und Henning Schröder (Fraunhofer IZM, Germany)

Wednesday, October 25, 1:10 – 2:50 pm – presentations

1:30 - 1:50 pm: Session C5 – Aufbau- und Verbindungstechnik

Herausforderungen bei der Realisierung von silbergesinterten FC-Kontakten für HT-Sensorsysteme
Olaf Rämer (Technische Universität Berlin, Germany); Constanze Weber and Matthias Hutter (Fraunhofer IZM, Germany); Malte Spanier (Technische Universität Berlin, Germany); Andreas Ostmann (Fraunhofer IZM, Germany); Martin Schneider-Ramelow (Fraunhofer IZM & TU Berlin, Germany)

2:10 - 2:30 pm: Session C5 – Aufbau- und Verbindungstechnik

Hermetic packaging for photonic integrated circuits on glass interposers
Daniel Weber, Kevin Kröhnert und Oliver Kirsch (Fraunhofer IZM, Germany); Norbert Ambrosius (LPKF Laser & Electronics AG, Germany); Henning Schröder and Michael Schiffer (Fraunhofer IZM, Germany); Martin Schneider-Ramelow (Fraunhofer IZM & TU Berlin, Germany)

2:30 - 2:50 pm: Session A5 – Prozesstechnologien

Herstellung von IC Substraten mittels semi-additiver Kupferabscheidung unter Verwendung einer maschinell optimierten Anodensteuerung
Ruben Kahle (Fraunhofer IZM, Germany)

2:30 - 2:50 pm: Session C5 – Aufbau- und Verbindungstechnik

Technical Feasibility Study of Massive Parallel Assembly and Interconnect for Micro-LEDs
Charles-Alix Manier, Kai Zoschke und Hermann Oppermann (Fraunhofer IZM, Germany)

Wednesday, October 25, 2:50 - 3:50 pm – poster sessions

P2.3 E – Kommunikation & Sicherheit

Inductive sensor with integrated components
Dincer Sirkeci (Technical University in Berlin, Germany)

P2.6 C – Wirtschaft und Arbeit

Entwicklung einer KI-basierten Prozessoptimierung in einer vertrauenswürdigen verteilten Fertigung über die gesamte Prozesskette
Steve Voges (Fraunhofer IZM, Germany)

Wednesday, October 25, 3:50 - 5:30 pm – presentations

3:50 – 4:10 pm: Session D6 – Nachhaltigkeit als Chance und Wettbewerbsvorteil

Kompetenzzentrum für eine ressourcenbewusste Informations- und Kommunikationstechnik – Green ICT @ FMD
Nils F. Nissen (Fraunhofer IZM, Germany)

4:50 - 5:10 pm: Session D6 – Nachhaltigkeit als Chance und Wettbewerbsvorteil

Energie- und Ressourcenbedarf der IKT in Deutschland bis 2035
Nils F. Nissen (Fraunhofer IZM, Germany); Lutz Stobbe (Fraunhofer IZM, Germany)

This might also be of interest to you

Research Fab Microelectronics Germany

To reinforce the position of Europe’s semiconductor and electronics industry beside global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with the IHP GmbH - Innovations for High Performance Microelectronics and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, come up with a concept for a cross-location research factory for microelectronics and nanoelectronics.

www.forschungsfabrik-mikroelektronik.de/en

Events

Conference / October 23, 2023 - October 25, 2023

MikroSystemTechnik Congress 2023

More info

Event details

Registration

Location

Organization

Solutions for Sustainable Digitalization

The Sensor Packaging Revolution - High-frequency Technology Entirely in Glass

SieVei 4.0

Omniconnect

IMUCOMPACT

ZIM OpRes

PhotMan

iCampus Fortune II

Conference presentations MST Congress 2023

Tuesday, October 24, 3 pm - 4 pm – poster sessions

Wednesday, October 25, 1:10 – 2:50 pm – presentations

Wednesday, October 25, 2:50 - 3:50 pm – poster sessions

Wednesday, October 25, 3:50 - 5:30 pm – presentations

This might also be of interest to you

Research Fab Microelectronics Germany

Contact Press / Media

Susann Thoma