The Electronic Components and Technology Conference (ECTC) is one of the leading international events in the area of packaging, components, and microelectronic systems technology. ECTC 2009 was held at Sheraton San Diego Hotel & Marina, San Diego, CA, USA from May 26 to May 29, 2009.

This year, Fraunhofer IZM participated in the ESTC exhibition for the first time, presenting its range of services from the realm of electronic packaging to the American Packaging community. A lot of our overseas partners and customers took the opportunity to get up to date with recent IZM developments.