As every year, the SMT/HYBRID/PACKAGING in Nürnberg was our most important German event and an excellent opportunity to catch up with partners and customers from Germany and abroad.

From April 16-18, 2013 Fraunhofer IZM presented its entire range of services in the area of electronic packaging, smart system integration and reliability analyses. This year's special focus was on electronics for harsh environments. Materials and interconnection technologies for high temperatures were presented along with the institute's testing and material characterization portfolio for the range up to 500 °C.