After last year's successful debut, the European 3D TSV Summit, organized by SEMI Europe, took place for the second time from January 22-23, 2014 in Grenoble. The theme of this year’s event was “Application Ready,” addressing 3D TSV from both a business and technology perspective.

Fraunhofer IZM's ASSID Center ("All Silicon System Integration Dresden") was co-organizer of the European 3D TSV Summit and presented its latest research results both at the conference and at the concurrent exhibition.

more Information: http://www.semi.org/eu/node/8566

For pictures from the event, please click here: http://www.pierrejayet.com/SEMI