The 65th Electronic Components and Technology Conference (ECTC) attracted more than 1500 experts from assembly and connector technology and microsystems engineering to San Diego, CA, between 26 and 29 May 2015. As one of the world’s premier conferences in the field, the Fraunhofer IZM was proud to maintain a strong and versatile presence and contribute substantially to the proceedings.

In dedicated half-day seminars, Ivan Ndip and Michael Töpper (“Fundamentals of Electrical Design and Fabrication Processes of Interposers Including Their RDLs”) and Tanja Braun and Hans Walter (“Moisture and Media Influence on Microelectronic Package Reliability”) offered their audiences in-depth insights into their fascinating research endeavours. Five other colleagues also gave talks at the conference. The Fraunhofer IZM booth at the exhibition accompanying the conference drew in many interested attendees and was a great opportunity for showcasing the many and versatile competences of the institute.

In recognition of their long-standing and reliable work as editors of the conference proceedings, Jürgen Wolf of the Fraunhofer IZM and Ehrenfried Zschech of the Fraunhofer IKTS Dresden were honoured with the ECTC Contribution Award.