This year’s European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, was held in Rimini, Italy from June 15-18, 2009. The biannual Conference is one of Europe’s most important packaging events, bringing together specialists from industry and academia.

Various Fraunhofer IZM researchers contributed presentations to the conference and the institute also exhibited its range of services and current research results at the concurrent exhibition.