The approach to realize embedded heterogeneous systems using vertical System-in-Package (SiP) technology is increasingly gaining importance. However, there is a lack of automated support for the design of integrated 3D solutions. At this year’s embedded world in Nürnberg Fraunhofer IZM presented a development workflow, which not only relieves the designer of the time-consuming 3D component placement. It also features a preview of different technological realizations, allowing a comparison of several technological options on an objective base. This new approach has been developed together with Fraunhofer ITWM, Kaiserslautern.

Another focus of the presentation was on exemplary realizations of autonomous sensor systems for the branches medical technology, logistics and automotive. Here a passive RFID system with a bistable display in a smart label format, designed to replace paper in logistics processes, met with special interest from the visitors.

“We are very pleased” comments Stephan Guttowski, head of Fraunhofer IZM’s System Design and Integration Department.“We weren’t quite as busy as last year, but the number of valuable leads was considerably higher.”