The focus of Fraunhofer IZM’s presentation at this year’s SMT fair in Nürnberg was on substrate processing. For several years IZM-scientists have been working hard to develop innovative processes for embedding electronic components and realizing ultra-fine line structures. Currently a new prototyping and process line for these technologies is being set up at the institute’s headquarters in Berlin. Using the new equipment, substrates with a maximum size of 610 mm x 456 mm can be continuously processed. The first substrates with ultra fine line structures processed with the new manufacturing line were presented at the IZM booth in Nürnberg.

Other highlights included:

• Wafer level packaging (wafer level molding, thin chip integration, 300 mm 3D prototyping)
• Substrate integration (embedding, flip chip, COB, encapsulation & molding, flexible systems)
• Reliability (methods, qualification, Process- and failure analysis)
• Power electronics (system design, sintering, soldering, bonding, cooling concepts, reliability)
• Cost-effective optical interconnection technology
• „Green Packaging“ (green design, material impact, green technology)
• New technologies (e.g. technological platform for cancer research, self-assembly technologies)