Fraunhofer Institute for Reliability and Microintegration IZM»From Package to Application« – Technology Day at Fraunhofer IZM
September held a special treat for over 100 interested guests as Fraunhofer IZM, one of the world-leading institutions in advanced packaging, answered the question: Which package does my application need? The Technology Day focused on three application areas: Wireless Communication and Connectivity, Automotive & Transportation und Medical Technology and Sensors. The talks explained how different components, regardless of their application, can be brought together to serve an overall system. This appealed especially to engineers and technicians from development, construction and production in the automotive and supplier industries, including mechanical, electrical and medical engineering.