Over recent years power electronics has developed into an increasingly important area of microelectronics. As an interdisciplinary technology it plays a key role in a multitude of applications, from automotive and safety to information and communication technologies. On 17 September 2015 experts from all over Europe gathered in the Berlin Fraunhofer Forum for the Workshop »Reliability in Power Electronic Packaging« to discuss current trends and developments in packaging and interconnection technologies for power electronics. Topics were, among others, power electronics in harsh environments, factors influencing the reliability of power modules and failure mechanisms.