In 2016, Fraunhofer IZM began cooperating with a group of leading industry partners from Europe, the United States, and Japan to develop the fundamental processes for new panel level packaging technologies that are being transitioned into full series production. The Institute and its 17 partners completed the second phase of this Panel Level Consortium (PLC 2.0) last year and marked this occasion with the first in-person get-together since the Pandemic.

The final meeting of the Consortium on 7 September 2022 was followed by the 4^th Panel Level Packaging Symposium, which saw experts from industry and research speaking about the status quo, recent advances, and the limitations of panel level packaging. After the talks, the more seventy attendees were given an exclusive tour of the lab facilities of Fraunhofer IZM, before the day’s proceedings ended with an evening reception for more networking and conversations.