Lars Boettcher, Dionysios Manessis, Andreas Ostmann Stefan Karaszkiewicz and Herbert Reichl received the 2008 Outstanding Paper Award of the 3rd IMPACT and 10th EMAP Joint Conference for their excellent contribution entitled, “Embedding of Chips for System in Package Realization – Technology and Applications”. The award was presented to Lars Böttcher by conference chair Shen-Li Fu at the official award ceremony during the conference in Taipei, Taiwan on October 24, 2008.

With almost 200 papers and 600 participants, the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP) was one of the biggest events in the realm of microelectronic packaging worldwide.

The paper presented by Lars Böttcher describes the realization of packages and system-in-packages (SIP) with embedded components. The developed embedding technology basically focuses on the use of standard PCB processes within a PCB production environment. In the HIDING DIES project, the generic technology was further developed to offer versatile solutions for the realization of 3D-SiP modules. The newly established European project “HERMES” will focus mainly on industrial adaptation of embedding technologies with an additional scope of furthering also the existing technological capabilities at prototype level. The paper discusses the new challenges that arise within the HERMES project.