Fraunhofer IZM on the road... the Institute traveled to trade fairs and congresses in San Francisco, Cambridge and Dresden in 2023. It all started in February with Photonics West in San Francisco, where IZM researchers presented the latest developments in the field of photonic packaging.

This was followed in May by the trade fair trio of Sensor + Test, PCIM and SMTconnect in Nuremberg – a logistical challenge for everyone involved every year. The undisputed highlight of the SMT for many years has been the Future Packaging production line, supervised and masterfully staged by IZM colleague Ulf Oestermann. This year, IZM had another crowd-puller in store – a ten-meter-wide graphic on high-end performance packaging illustrated new integration solutions in advanced packaging and attracted many curious visitors to the stand. You can also find the graphic on page 6 of this annual report.

The IZM trade fair year was rounded off in autumn with the MST-Kongress in Dresden, where the Institute not only had a stand, but also contributed several papers to the congress program. The focus here was on meeting and exchanging ideas with customers and project partners.