Every year, the 3DInCites Awards are given to individual and institutional recipients for their exceptional contributions to the hetero system integration of semiconductors in a range of categories, e.g. for work in the fields of 3D or Fan-Out Wafer-Level Packaging. The Institute’s researchers are particularly proud of winning the award in the important category »Research Institute of the Year«, as its winners are chosen by the packaging community as an expression of genuine appreciation among the packaging professionals of the world.

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