Ivan Ndip, Werner John and Herbert Reichl received the 2005 ECTC Best Poster Paper Award for their excellent contribution entitled, “Effects of Discontinuities and Technological Fluctuations on the RF Performance of BGA Packages”.

The award was handed over to Ivan Ndip by Eric Perfecto (2005 ECTC Program Chair) and Torston Wipiejewski (2006 ECTC Program Chair) at the 56th Electronic Components & Technology Conference (ECTC 2006) in San Diego, CA., U.S.A., on May 31st 2006.

ECTC is the premier international conference which brings together the best in packaging, components, and microelectronic systems science, technology and education in an environment that fosters technical exchange. It is held annually in U.S.A. and jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) and the Electronic Components, Assemblies, and Materials Association (ECA), the components sector of the Electronic Industries Alliance (EIA). ECTC 2005 was held at the Wyndham Palace Resort and Spa in Lake Buena Vista, FL, U.S.A., from May 31- June 3, 2005.