The work systematically compares four different approaches to increase alignment accuracy, evaluates the technological pros/cons also experimentally and provides experimental proof to the applicability of the high precision alignment solution found. This solution enables for the manufacturing of functional 3D antennas and can be used for the realization of highly integrated RF communication modules or Radar sensors with an extended field of view. The compatibility with fan-out process flows makes this contribution even more relevant.  

Nyke is a working student at Fraunhofer IZM, while working on his Master’s degree in Material Science at the Technical University of Berlin. His main areas of activity are joining and encapsulation processes based on polymer materials using compression molding.

This year’s IEEE ESTC Conference brought 430 attendees from 27 countries to Berlin from 11 to 13 September 2024. The IEEE ESTC is the premier European event for researchers and industry representatives interested in the latest developments in packaging and interconnection technology. The biennial conference has been organized by the IEEE Electronics Packaging Society ever since 2006.