Extremely small and powerful components can be created through system integration. But how can the great challenges of different technologies, sizes and materials, as well as electrical and mechanical connections and reliability, be mastered? Fraunhofer IZM answered these questions together with its colleagues from Fraunhofer USA at IMAPS 2020. More than 200 participants watched the presentations of the internationally renowned Fraunhofer experts* and exchanged ideas in live Q&A.

This workshop was part of this year's IMAPS 2020, 53rd Symposium on Microelectronics: www.imaps2020.org.