Dr. Ivan Ndip has been honoured as a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) for his numerous technical contributions and multiple leadership roles in the society. He received the Award during the 47^th International Symposium on Microelectronics that took place in San Diego, CA, USA, from Oct. 13 - 16, 2014.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies worldwide.

Dr. Ndip has made significant contributions in the field of electromagnetic modeling, design and optimization of microelectronic components, modules and systems for RF and high-speed applications. He has authored and co-authored more than 130 scientific publications, won numerous best paper awards at leading international conferences and taught Professional Development Courses to hundreds of practising engineers and scientists worldwide. He leads the Department of RF & Smart Sensor Systems at Fraunhofer IZM Berlin. He is also a Lecturer at the Technical University Berlin, where he currently teaches graduates courses on Electromagnetic Compatibility (EMC).

Dr. Ndip chairs the Signal & Power Integrity Committee at IMAPS. He is an Associate Editor of the Journal of Microelectronics and Electronic Packaging. He is also a reviewer of IEEE Transactions on EMC, CPMT, MTT, ED, and other international Journals. Dr. Ndip is a member of the Technical Program Committee of many IEEE and IMAPS international conferences. He was Technical Co-Chair of the 44th and 45th International Symposiums on Microelectronics in Long Beach, and San Diego, CA, USA, in 2011 and 2012 respectively. In 2013 he was the Technical Chair of the 46th International Symposium on Microelectronics in Orlando, FL, USA and in 2014 he was the General Chair of the 47th International Symposium on Microelectronics, in San Diego, CA, USA. He is the General Chairman of the 19^th IEEE Workshop on Signal and Power Integrity (SPI 2015) to be held in Berlin, Germany, from May 10 to 13, 2015.