To make use of the superior properties of wide-bandgap semiconductors, power modules need an optimum thermal performance, good parasitic electromagnetic properties, a high temperature capability and the possibility for a high degree of integration. Christoph Marczok’s paper demonstrates a new setup for power modules with SiC power MOSFETs using multilayer ceramic substrates with direct substrate water-cooling. The power modules are encapsulated by transfer molding with a metallized and structured copper layer on top. SMD components are soldered directly on this metallization. Finally, the paper contains the double pulse switching results of the power module.

The paper is co-authored by Prof. Eckart Hoene (Fraunhofer IZM), Tina Thomas (Fraunhofer IZM), Andreas Meyer (Rogers Germany GmbH) and Karsten Schmidt (Rogers Germany GmbH).

The award ceremony takes place at the opening session of the PCIM Europe Conference on 7 May 2019 in Nuremberg.