Peter Ramm was the 2009 recipient of the IMAPS society’s prestigious William D. Ashman Award for his "pioneering work on 3D IC stacking and integration".

The award ceremony took place at the IMAPS International Symposium, in November 2009 in San Jose, California, and the award was presented to Peter Ramm by IMAPS-president Steve Adamson. Peter Ramm sees this honour as an appreciation of his Munich team’s excellent work on 3D integration for more than 2 decades.