Professor Herbert Reichl received SEMI Europe Award on October 19, 2010 for his extraordinary contribution to the field of semiconductor and microsystem packaging. The award was presented to Professor Reichl by SEMI President Stan Myers and SEMI Europe President Heinz Kundert at the SEMICON Europa Conference and Exhibition in Dresden.

In his tribute speech, the chair of the Semiconductor Technology Program Committee, Mart Graef, singled out Herbert Reichl’s pioneering research in the development of integration technologies (hetero integration), which laid the foundation for current trends such as vertical system integration. Many of the technologies and processes developed or advanced by Professor Reichl and his colleagues are widely used in the industry today, among them flip chip interconnection technology and electroless Nickel bumping.

Until March 2010, Professor Reichl was Director of Fraunhofer IZM and Head of the Forschungsschwerpunkt Microperipheral Technologies at the TU Berlin. His scientific output to date has been impressive, with more than 60 patent applications, over 950 scientific papers and numerous textbooks. For his outstanding achievements he received, among others, the Federal Cross of Merit, an honorary doctorate from the University of Chemnitz, the VDE’s Golden Ring of Distinction (Goldener Ehrenring) and he was made an IEEE Fellow.