This represents a major step for research, as it demands a rethinking of established semiconductor technology with cost-efficient gallium nitride on silicon (GaN-on-Si) and silicon germanium (SiGe) components and heterogeneous casing designs.

There is substantial demand in the industry for cheaper HF systems for future markets, such as 5G communication or driverless cars. Such systems will increasingly be using novel antenna and electronic beamforming technologies, which will depend on the availability of energy and cost-efficient high-performance transmitters to function.

Under the leadership of Dr. Ivan Ndip, Fraunhofer IZM contributes the HF design and the construction and testing of the system integration platform to the project.