Tech News

The Fraunhofer Institute for Reliability and Microintegration IZM announces its active contribution to the APECS pilot line launched as part of the EU Chips Acts. APECS intends to promote the development and integration of chiplet technologies as a means of making Europe’s semiconductor industry more competitive.

The CORNET project Alu4CED has been awarded the prestigious Gold Medal for Innovation at the Kaohsiung International Invention & Design EXPO (KIDE 2024). The organizers recognized Alu4CED for its innovative contribution to sustainable electronics: a “multifunctional aluminum-based housing for electronic devices in the circular economy.”

Waveguides, integrated in glass, have the potential to significantly boost the measuring accuracy of sensors in science and industry. In the “3DGlassGuard“ project, a consortium including Fraunhofer IZM is working on a sensor for measuring the density of seawater that can potentially help generate more consistent climate models. The researchers are also planning to create sensors in glass for power electronics, using innovative optical 3D microstructures and AI design processes.

Today, Germany’s President Frank-Walter Steinmeier honored the winners of the Deutscher Zukunftspreis 2024 at a formal ceremony in Berlin. The award was presented to a team of experts led by Dr. Norwin von Malm and Stefan Grötsch from ams OSRAM and Dr. Hermann Oppermann from the Fraunhofer Institute for Reliability and Microintegration IZM for the technological implementation of their idea — an LED matrix that turns car headlights into projectors. The LED technology developed by the team opens up new possibilities for innovative designs thanks to its high-resolution light distribution and its energy efficiency.

On November 8, Fraunhofer IZM welcomed Patrick Hetzel, the French Minister of Higher Education and Research. In addition to Institute Director Prof. Ulrike Ganesh and Rolf Aschenbrenner, Deputy Director of the Institute, Fraunhofer researchers with French roots were also present. The meeting’s objective was to continue the dialog on future-relevant key technologies such as high-performance computing, quantum electronics, hardware security and sustainability. Of particular importance were strategic considerations regarding Europe's technological sovereignty in the semiconductor sector.

On the EnerConnect project, researchers at Fraunhofer IZM are testing bidirectional blocking gallium nitride (GaN) transistors to design a system that could be used with the next generation of active converters and rectifiers. The innovative hardware removes the need for a separate conversion stage and can achieve record 99% efficiency.

The Fraunhofer Institute for Reliability and Microintegration IZM has launched a Glass Panel Technology Group in response to strong industry interest. This initiative aims to develop glass-based substrates for advanced packaging and promote their use in data center technology and high-performance computing. Due to its material properties, glass offers a promising basis for technological innovations in microelectronics; in particular, its high dimensional stability allows ultra-fine conductor tracks, even below 5μm as structure widths.

Ivan Ndip has been honored with the 2024 Outstanding Educator Award by the International Microelectronics Assembly and Packaging Society (IMAPS) for his significant contributions to education for the microelectronics packaging industry.

Before they ever hit the market, reliable microelectronic systems need to be subjected to lengthy and cost-intensive qualification tests. Coordinated by Fraunhofer IZM, a group of high-profile companies, research institutes, and universities is now working on ways to replace these tests with much faster, more flexible, and more economical simulations.

We are very pleased to announce that our colleague Nyake Gahein-Sama won the Best Poster Award at this year’s IEEE Electronics System Integration Technology Conference (ESTC 2024) in Berlin. He was recognized for his contribution on “Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications”.