Symposium / January 30, 2019
Panel Level Packaging in Dresden and Berlin
Almost 100 participants came together for the fourth Symposium on »Status & Trends in Panel Level Packaging« at the Hilton Hotel in Dresden on Jan. 30, 2019. The meeting was a post event of the 3D & Systems Summit.
International experts from industry and science presented the latest research results from this exciting new manufacturing technology, including:
- Market and application trends
- Latest technology results for PLP
- Material, equipment and process developments for large area and fine line processing
- Cost analysis
Presenter | Title | |
---|---|---|
14:00 |
Dr. YoungGwan Ko, SAMSUNG Electro-Mechanics Co.Ltd. |
The FOPLP of Samsung & Beyond Moore |
14:30 | Michael Töpper, Fraunhofer IZM | How Fine Line Wiring Influences the Cost of Panel Level Packaging (PLP) |
15:00 | Dr. Andreas Plößl, Osram |
Opportunities of Panel-Level Packaging for LED-Fabrication |
15:30 | Hiroyuki Sakauchi, Ajinomoto | Advanced Insulating Film Materials for Fan-out application |
16:00 | Coffee Break | |
16:30 | Roland Rettenmeier, Evatec | Evatec's all-in-one FanOut process for organic substrates |
17:00 | Yuki Nakata, Meltex | The wet etching and stripping technology for Fan-Out Panel Level Packaging |
17:30 | Jan Vardaman, TechSearch |
The Fan-Out Panel Option: Where Does it Fit? |
18:00 | End | |
19:00 | Evening Event “Sophienkeller” |