Conference  /  September 11, 2024  -  September 13, 2024

IEEE ESTC 2024 comes to Berlin!

The 10th IEEE Electronics System-Integration Technology Conference will be taking place in Berlin from September 11-13, 2024. IEEE ESTC is the premier international event in the field of electronics packaging and system integration, including their application in industry. The conference is organized every two years in Europe and is sponsored by IEEE-EPS in association with IMAPS Europe.

This year’s conference is chaired by IZM-group leader and panel-level packaging expert Dr. Tanja Braun.

Range of topics

  • Advanced Packaging
  • Materials for Interconnects and Packaging
  • Optoelectronic Systems Packaging
  • Assembly and Manufacturing Technologies
  • Design Tools and Modeling
  • Power Electronics System Packaging
  • Advanced Technologies for Emerging Systems
  • Reliability of Electronic Devices and Systems
  • Flexible, Printed and Hybrid Electronics
  • RF, mm-wave and THz Systems Packaging

Proceedings and Publication in IEEE Xplore
As in previous years, the conference papers will be published in the conference proceedings and be available in the  IEEE Xplore database after the conference.