2.5/3D Technologies
- TSV Integration
- Silicon interposer TSV first
- TSV via middle
- TSV via last
- Device stack
- Glass interposer and TGV Integration
- 2.5/3D Interposer
- Backside Interconnects
- 3D Stack Formation
- Flexible High Density Multi-Layer Substrates
- Polymeric interposers based on thin film flex technology
High Density Redistribution
- High Density Redistribution
- Multi-layer Redistribution
- Polymers for high-density Interconnects
- Copper/Polymer Evaluation Kit
- Integration of passive devices
- Glass substrate and layers
- Fan-out Wafer-Level Packaging
- High-Density-Routing (RDL)
Wafer-Bumping
- Wafer Bumping via Electroplating
- Solder & pillar bumps
- Fine-pitch bumping for Pixel Detectors
- Fabrication of nanoporous old Structures
- Mechanical gold stud bumping
- Single chip bumping
- Electro chemische deposition
Wafer-Bonden
- Permanent wafer-to-wafer bonding
- Temporary wafer bonding for thin wafer handling
- Wafer level capping
Thinning/Singulation/Dicing
- Back grinding tape lamination
- Wafer backgrinding
- Polishing
- mechanical blade dicing
- laser grooving
- laser stealth dicing
- wafer edge trimming
High-Density Assembly
- Fine pitch assembly for pixel detectors
- Detector packaging for medical x-ray imaging and x-ray crystallography
- Interconnect metallurgy and processes
- Thermo compression bonding
- Chip-Stacking
- Fine-pitch flip chip (FC) assembly & die bonding
- Wafer-level solder ball attach (100 – 500 μm)
- Evaluation of low-temperature assembly technologies
- Evaluation of flux free solder connections with self alignment capability
- Reliability investigation of flip chip interconnections
- Chip to Wafer Assembly
Failure Analysis & Reliability Investigation
- Metrology: Bump heights / TSV depth measurement, defect inspection, topology, layer thickness, wafer thickness & bow/ warp (VIS), wafer thickness (infrared), die warpage measurement, physical failure analysis, preparation techniques 3D stack
- FIB / REM imaging
- Copper/polymer evaluation kit - Interdigital finger-type capacitors
Sensor Development
- Sensor design
- Reliability and lifetime optimization
- Standard and customer-specific packaging with integrated sensor data processing e.g. TO8, packages with media separation, molding
- Characterization of pressure (10 m-100 Bar), gas and acceleration sensors (up to 40 g)
- Planar technologies (SiO, SIN deposition, Sputtering)
- Overview sensor activities