Embedding & Substrate Technologies

The interconnect behavior of any surface finish depends on layer built up, surface cleanliness, process bath chemistry, chemical and thermal stability, surface profile, pad design.

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Embedding is the process of integrating components, often chips, in PCBs. Both active and passive components can be embedded in laminates. The process has many advantages over conventional packaging techniques.

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Silicon carbide semiconductors, packaged for high-temperature applications, have the potential to increase switching frequencies and output substantially in future power electronics, while making them less susceptible to failure.

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• CoB laboratory (die, ribbon, wire bonding down to 35 µm pitch)
• Precision mounting laboratory (clean room, including chip-to-wafer bonder to 300 mm, thermocompression, thermosonic)
• Embedding laboratory (high-precision pick and place machine, circuit board processing line, including laser drill and laser-direct imaging)
• Optical laboratory (including hot embossing, micro-optical assembly, component and system characterization)
• Micromechatronics laboratory
• Encapsulations (conformal coating, potting, flip-chip and CoB molding, needle and jet dispensing, transfer and liquid molding, wafer-level encapsulation)
• Textile laboratory (integration of electronics in textiles)
• SMD & flip chip line (Datacon EVO, Siplace X-Placer, Asymtek Axiom Jet, Dispense System)