Fraunhofer Institute for Reliability and Microintegration IZM
Power module from the SiC module project (design IZM, PCB production Schweizer Electronic AG*) including X-ray image. It can be seen that, particularly in the plane between the assembled substrate and the cooler, there is a very good large-area soldering (very good wetting and only very few small pores present) with a Sn-based solder.
Optimized thermal management is particularly important in power electronics. Improving the thermal connection between the package/module and the cooling structure can increase the service life of the overall system many times over.
Soldered, silver- or copper-sintered connections with correspondingly high thermal conductivities represent a game changer in terms of heat dissipation compared to the typically used polymer thermal interface materials (TIM).