![Großflaechige Loetung Großflaechige Loetung](/en/abteilungen/system_integrationinterconnectiontechnologies/arbeitsgruppen/wg-metallic-interconnection-technologies/metallic-connection-to-the-cooling-system-for-power-electronic-modules/jcr:content/contentPar/sectioncomponent/sectionParsys/textwithasset/imageComponent/image.img.jpg/1700490671756/Grossflaechige-Loetung.jpg)
Optimized thermal management is particularly important in power electronics. Improving the thermal connection between the package/module and the cooling structure can increase the service life of the overall system many times over.
Soldered, silver- or copper-sintered connections with correspondingly high thermal conductivities represent a game changer in terms of heat dissipation compared to the typically used polymer thermal interface materials (TIM).