Fraunhofer Institute for Reliability and Microintegration IZMProjects
ASTROSE - VISION
Quantum sensor technology through optical integration for gravimetry with cold atoms
QuoGkA (2024-2027)
The goal of the project is to develop a compact atomic gravimeter. The measurement principle is based on atom interferometry, using cold atoms. Nomad Atomics can realize such gravimeters on a laboratory scale, but systems are needed that can measure gravitational fields, for example, from a drone. To achieve a compact and lightweight system, a large part of the optical components and an Rb gas cell are to be integrated onto and within a glass platform.
3D Integration for Quantum Computing
TO.QI (2024-2027)
The rapidly growing demand for computing power, particularly in relation to quantum computing, artificial intelligence and “Internet of Things” (IoT) applications, urgently requires new microelectronics solutions to counteract the associated drastic increase in energy consumption and reduce greenhouse gas emissions. The aim of the TO.QI project is therefore to develop technology modules, which should enable research-oriented pilot production of new components and heterointegration methods.
Scalable Packaging for All-Optical CV Quantum Computing
SPOC (2024-2026)
The aim of this project is to build an innovative system for photonic quantum computing. In order to physically realize such a system, an innovative integration and system concept is required that takes into account the factors of decoherence, fault tolerance and scalability of the construction process.
New data transmission technologies for computer tomographs
SEMECO A1 (2023-2026)
Main goal within this project is a feasibility study to investigate the replacement of data transmission in computer tomographs currently using mechanically complex slip rings with scalable wireless data transmission. This bears the potential to enable revolutionary data rates for new sensor generations and a reduction of mechanical demands on accuracy as well as scanning duration. With a wireless solution, CT-scanner can reach a higher reliability level, potentially leading to a longer tool lifetime.
Additive Manufacturing of Solar Panels for spACE applications
AM-SPACE (2023-2026)
The AM-SPACE (- Additive Manufacturing of Solar Panels for spACE applications) project addresses several of these challenges. Instead of heavy metal hinges, memory plastics are being developed that mechanically and electrically connect the individual solar elements.
A multi-hub Test and Experimentation Facility for edge AI hardware
PREVAIL (2023-2025)
The PREVAIL project will create a multi-hub Test and Experimentation Facility (TEF) for edge AI hardware. This infrastructure will enable a trusted, non-discriminatory test facility in Europe capable of validating high-performance, low-power edge components and technologies to support digital transformation.
Four major European Research and Technology Organizations (RTOs) have set up this consortium to build on their advanced 300mm fabrication, design, and test facilities in a coordinated and complementary fashion.
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Expanded Ecological Impact Assessment of the Thuringian Repair Bonus Scheme
REBO 4.0 (2023 - 2024)
The Repair Bonus launched in 2021 by the Department for the Environment, Energy, and Nature of the State of Thuringia in cooperation with the Thuringian Consumer Protection Agency (VZTH) is a first for Germany by introducing a meaningful commercial incentive for product repairs.
NerveRepack
(2022 - 2027)
NerveRepack is a groundbreaking research project that aims to transform the lives of individuals with amputated or paralyzed limbs. The project's mission is to design and fabricate innovative implantable neuronal interfaces that can bidirectionally communicate with exoprostheses and exoskeletons.
Competence Center "Green ICT @ FMD"
(2022 - 2026)
In order to contribute to reducing the carbon footprint of digital technologies through research and development, the Fraunhofer and Leibniz Institutes cooperating in the Research Fab Microelectronics Germany (FMD) are jointly establishing a cross-location competence center for resource-conscious information and communication technology and sustainable electronics.
Fraunhofer IZM is part of the Green ICT Competence Center and has been commissioned to determine the energy requirements and life cycle assessment of electronic products and information and communication technology infrastructures for Germany for the period 2013 to 2033.
Increased use of recycled plastics in electronic products
INCREACE (2022 - 2026)
The INCREACE project was funded by the European Union's Horizon Europe research and innovation program to tackle the above-mentioned issues. The diverse and interdisciplinary consortium develops innovative solutions along the entire plastics recycling value chain embedded in a systemic framework.
Failure-corrected Quantum Computer based on superconductive quantum Processors
QSolid (2022-2026)
The joint project »Quantum computer in the solid state – Qsolid« with a duration of 5 years started on January 1st, 2022 under the leadership of the project partner Forschungszentrum Jülich (FZJ). The overall goal is the development of a more failure-corrected quantum computer based on superconductive quantum processors as well as its early integration into the existing supercomputer infrastructure at FZJ. A first demonstrator is planned to come on stream in 2024 and to be available for early tests of applications as well as benchmark investigations. In the further course of the project, the extension to a multi-processor machine is planned that will allow the use of different next generation superconductive quantum processors.
OCTAPUS
(2022 - 2026)
OCTAPUS (Optical Circuit switched Time sensitive network architecture for high-speed Passive optical networks and next generation Ultra-dynamic & reconfigurable central office environments) is a 3.5-year long H2021 research project aiming to deliver an agile, low-cost and energy-efficient PIC technology framework that will re-architect the NGCO ecosystem, transparently upgrading its capacity to 51.2Tb/s and beyond, through an innovative optically-switched backplane and transceiver toolkit.
Split Manufacturing of novel and trustworthy Electronics
T4T (2022-2025)
A reliable supply with electronic components is gaining more and more strategic relevance for the industrial site Germany.
The increasing shift of IC manufacturing to regions outside Europe bears a higher risk of malicious/spy functions in components delivered by contract manufacturers (Foundries) as well as IP theft (intellectual property) with respect to the used circuit designs.
The project »Trustworthy electronics: tech-for-Trust (T4T)« aims at providing tools for accessing safe supply chains and trustworthy electronics to domestic industry.
Supercomputing platform for fully automated vehicles
CeCaS (2022 - 2025)
Fraunhofer IZM is contributing its expertise in the packaging of central car server chiplet modules on organic interposers. Our researchers are developing flip-chip assembly concepts and thermal interfaces for sustainable, scalable cooling concepts for this complex central car server. Derived from the research work on packaging, contributions are being made to the digital twin for the reliability assessment of chiplet-based electronic modules.
Setting ground for the European Product Passports
CIRPASS (2022 - 2024)
The "CIRPASS" project aims to lay the foundations for the future implementation of digital product passports in the EU. Tasks include creating a forum to develop a common understanding of cross-sector DPPs and building stakeholder consensus on prototypes of the DPP in the sectors: Batteries, Textiles, and Electronics.
QuantumCascade
(2022 - 2024)
The objective of the QuantumCascade project is the design of a multispectrum MIR light source as an easily integrated system component for use in applications that work with mid-infrared light. The system should be usable without requiring particular knowledge of the complex technology behind multispectrum light sources. This makes it available for commercial enterprises from other fields, e.g. medical technology, facilitating the development of innovative systems without the risk of having to design a stable and controlled light source of this type.
Realizing Trustworthy Complex Systems with Wafer-Level Packaging
VE-REWAL (2021 - 2024)
May 1, 2021, was the launch day of the three-year project “Realizing Trustworthy Complex Systems with Wafer-Level Packaging - VE-REWAL”, led as a combined effort by the University of Bremen’s Institute for Theoretical Electrical Engineering and Microelectronics. The project intends to explore concepts for a platform for trustworthy electronics with a novel system partitioning approach, suitable system packaging technology, and secure communication between the system’s components. A 77GHz-Radar MIMO application was chosen as test case for a chiplet design for radar ICs, investigated in FOWLP form, as a complete assembly, and in active use.
Sens4Bee
(2021 - 2024)
Sens4Bee – Monitoring colony health with RFID sensors capturing data in beehives and on individual bees.
Ascent+
(2020 - 2024)
Continued innovation and the development of new nano-electronic technologies depend on cutting-edge facilities. The ASCENT+ taps into the resources of a rich and diverse network of science and industry partners to offer open access to this vital infrastructure for nano-electronics.
PACK4EU
(2020 - 2024)
The Pack4EU project’s ambition is to help and guide the European Commission on how to finance the EU packaging industry.