Wenzel received the award for her paper "Influence of Heat Treatment on the Quality of Die-to-Wafer Hybrid Bond Interconnects", which she submitted as a technical paper and presented on site as a poster. The paper examines the effects of certain process influences during hybrid bonding, a technology that has become increasingly important in the semiconductor industry in recent decades. This technology enables ultra-high interconnect density, scaling of interconnect size, and heterogeneous integration as well as a high reliability at maximum system performance, and in harsh environment conditions. Therefore, hybrid bonding has emerged as an attractive but complex alternative to solder-based interconnect technologies. Hybrid bonding has therefore established itself as an attractive, albeit complex, alternative to solder-based connection technologies. The work presented was funded as part of the BMBF project "Distributed Manufacturing for Novel and Trustworthy Electronics - T4T" (FKZ 16ME0481) and Wenzel's doctoral activities. The study was carried out in collaboration with the company TEL and the Institute of Electronic Packaging Technology (IAVT) at the Technical University of Dresden.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

This year marked the 74th edition of the conference, which was the most successful to date with 2007 participants and 125 exhibitors.

The "ECTC Student Travel Award" is offered annually by the IEEE Electronic Packaging Society (EPS) and is awarded to up to 15 students or doctoral candidates who are enrolled at an accredited institution in a study program related to the conference and are the main author of a submitted paper. The prize money is intended to cover travel expenses.