Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
- Integration of inertial sensor and ASIC integration on 2.5D Interposer
- Silicon Interposer for decoupling MEMS device and ASIC
- Interposer and devices assembeld on organic board
- Improves sensor accuracy by noise reduced analog signaling
- Realized within the project SIMEIT (funded by the Free State of Saxony)
- Mounted on laminate package board