Go4Time

Überblick

GlObal, Flexible, On demand and Resourceful Timing IC & MEMS Encapsulated System

Overall goal of the project was the development of manufacturing concepts for highly stable, generic, low-cost timing devices suitable for power aware, long autonomy and portable telecommunication systems such as mobile phones. One milestone in this project was the wafer-level fabrication of a MEMS package consisting of an active CMOs wafer with vertical copper-filled TSVs and bonded cap wafers for hermetic sealing of resonator components.

 

 

 

Top view of the created SiPs with a size of 1,64 x 1,25 x 0,65 mm³
Cross-sectional view of wafer level packaged timing micro system based on TSV CMOS IC bonded with silicon cap, hermetically sealed quartz crystal and top side mounted BAW filter

General Project Information

Go4Time is a project funded by the European Commission under the Seventh Framework Programme (FP7)  call 5.9: "Microsystems and Smart Miniaturised Systems"